Printed circuit board manufacturing method and printed circuit board

The embodiment of the invention provides a printed circuit board manufacturing method and a printed circuit board, and the method comprises the steps: enabling a plurality of layers of core boards to be connected in a stacked manner to obtain a mainboard, enabling the core board to comprise a substrate layer and a copper foil layer, and enabling the copper foil layer of the core board located at the outermost layer of the mainboard to serve as an initial copper layer; etching the initial copper layer, and forming a circuit area and a blind hole area which are used for exposing the substrate layer on the initial copper layer; dissolving the substrate layer exposed in the circuit area by using an alkaline solution to form a target circuit groove, and dissolving the substrate layer exposed in the blind hole area to form a target blind hole; forming a copper plating layer on the target circuit groove, the target blind hole and the initial copper layer; and carrying out flash etching treatment on the main board to