SEMICONDUCTOR PACKAGE

A semiconductor package includes: a lower semiconductor chip; a first upper semiconductor chip including an upper pad; and a bonding wire coupled to the substrate and the upper pad. The first upper semiconductor chip has: a first overhang region adjacent to a first side surface of the first upper semiconductor chip; a second overhang region adjacent to a second side surface of the first upper semiconductor chip; and a first corner overhang region adjacent to a corner where the first side surface and the second side surface intersect each other. The upper pads include a first upper pad on the first overhang region and a second upper pad on the second overhang region. The number of the first upper pads is smaller than the number of the second upper pads. The upper pad is spaced apart from the first corner overhang region. 一种半导体封装件包括：下半导体芯片；第一上半导体芯片，其包括上焊盘；以及接合引线，其耦接到基板和上焊盘。第一上半导体芯片具有：第一外伸区域，其与第一上半导体芯片的第一侧表面相邻；第二外伸区域，其与第一上半导体芯片的第二侧表面相邻；以及第一拐角外伸区域，其与第一侧表面和第二侧表面彼此相交的拐角相邻。上焊盘包括在第一外伸区域上的第一上焊盘和在第二外伸区域上的第二上焊盘。第一上焊盘的数量