High-overload pressure sensor and preparation method thereof

The invention relates to a high-overload pressure sensor and a preparation method thereof, the high-overload pressure sensor comprises a silicon cup, a silicon boss and glass, the silicon cup, the silicon boss and the glass are sequentially arranged from top to bottom, the glass is in anodic bonding...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG SONGLI, LI MEIPU, SHEN JIANWU, XUE HAINI, WANG XI, ZHAO HU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TESTING TRANSPORTING
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