Cutting tool
A cutting tool provided with a base material and a hard layer provided on the base material, the hard layer including first unit layers and second unit layers, in the hard layer, the first unit layers and the second unit layers are alternately laminated, respectively, the thickness of the first unit...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A cutting tool provided with a base material and a hard layer provided on the base material, the hard layer including first unit layers and second unit layers, in the hard layer, the first unit layers and the second unit layers are alternately laminated, respectively, the thickness of the first unit layers is 2-100 nm, the thickness of the second unit layers is 2-100 nm, and the thickness of the second unit layers is 2-100 nm. The thickness of the second unit layer is 2-100 nm inclusive, the first unit layer is composed of a compound represented by TiaAlbBcN, the second unit layer is composed of a compound represented by TidAleBfN, the atomic ratio a of the titanium element in the TiaAlbBcN is 0.25 or more and less than 0.45, the atomic ratio b of the aluminum element in the TiaAlbBcN is 0.55 or more and less than 0.75, the atomic ratio c of the boron element in the TiaAlbBcN is more than 0 and less than 0.1, and the thickness of the second unit layer is 2-100 nm inclusive. The total of the atomic ratio a, th |
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