Hollowed-out finger flexible circuit board and manufacturing method thereof

The embodiment of the invention provides a hollow finger flexible circuit board and a manufacturing method thereof. The method comprises the following steps: drilling a first copper foil layer, a strength reinforcing layer and a second copper foil layer which penetrate through a base material to form a through hole; performing electroplating treatment on the through hole to form a copper plating layer so as to enable the first copper foil layer and the second copper foil layer to be conducted; carrying out etching and film stripping treatment on the part, except the through hole, of the second copper foil layer to form a finger pattern; cutting the strength reinforcing layer to obtain the hollowed-out finger flexible circuit board; and the strength reinforcing layer formed by polyimide is arranged at the finger position, so that the strength is improved, and the problems of deformation, breakage and the like of the hollow finger flexible circuit board caused by the operation process are solved. 本申请实施例提供了镂空手指柔