Preparation process of solder resist hole plugging ink for via hole of printed circuit board

The invention relates to the technical field of printed circuit boards, in particular to a preparation process of solder resist hole plugging ink for a via hole of a printed circuit board, the preparation process is completed by adopting a coating device in a matching manner, and the coating device...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AI YONGMING, NIE XUEFENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!