Preparation process of solder resist hole plugging ink for via hole of printed circuit board

The invention relates to the technical field of printed circuit boards, in particular to a preparation process of solder resist hole plugging ink for a via hole of a printed circuit board, the preparation process is completed by adopting a coating device in a matching manner, and the coating device comprises a support frame, a moving mechanism and a hole plugging mechanism. The two feeding pumps are matched with the feeding pipe in the process of moving in the opposite directions to synchronously feed the front side and the rear side of the via hole, so that the front side and the rear side of the via hole can be plugged at the same time, the time for respectively plugging the two sides of the printed circuit board through resistance welding is shortened, and the efficiency of plugging the two sides of the printed circuit board through resistance welding is improved; the through hole can be cleaned by the cleaning round rod and the cleaning sponge, so that the surface of the cleaned through hole is smoother a