High-performance golden finger and circuit board

The embodiment of the invention discloses a high-performance golden finger and a circuit board, the high-performance golden finger comprises a golden finger sheet and a PCB body, the golden finger sheet comprises a grounding golden finger, the grounding golden finger is provided with at least one gr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: XIAO GUANGRONG, TENG FEI, JI XINGJIE
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The embodiment of the invention discloses a high-performance golden finger and a circuit board, the high-performance golden finger comprises a golden finger sheet and a PCB body, the golden finger sheet comprises a grounding golden finger, the grounding golden finger is provided with at least one grounding via hole which is arranged in a penetrating manner, the front surface and the back surface of the PCB body are both provided with a plurality of golden finger sheets which are arranged side by side, and the PCB body is provided with a via hole in a penetrating manner. And the via holes are communicated with the grounding via holes of the grounding golden fingers arranged on the front surface and the back surface of the PCB body. The upper and lower grounding via holes are additionally arranged on the grounding golden fingers to communicate the grounding golden fingers on the front and back surfaces, so that the frequency domain performance of the signal channel is optimized, and the signal integrity of the