SUBSTRATE SUPPORT UNIT AND PLASMA PROCESSING APPARATUS

The present disclosure provides a substrate support unit including an electrostatic chuck configured to hold a wafer, an insulating isolation unit arranged below the electrostatic chuck and insulated from the electrostatic chuck, and a ground plate arranged below the insulating isolation unit, the electrostatic chuck, the insulation isolation unit and the grounding plate are mutually spaced in the vertical direction, and the lower surface of the electrostatic chuck, the surface of the insulation isolation unit or the surface of the grounding plate has hydrophobicity. 本公开提供一种基板支撑单元，包括：静电卡盘，被配置为固定晶圆，绝缘隔离单元，被排列在所述静电卡盘下方，并与所述静电卡盘绝缘，以及接地板，被排列在所述绝缘隔离单元下方，其中，所述静电卡盘、所述绝缘隔离单元和所述接地板在垂直方向上相互间隔开，并且所述静电卡盘的下表面、所述绝缘隔离单元的表面或所述接地板的表面具有疏水性。