Substrate processing chamber

The present invention relates to a substrate processing chamber, and more particularly, to a substrate processing chamber in which various processing processes are performed on a substrate, in which contamination on the inner side of the chamber is minimized and maintenance is simple. 本发明涉及一种基板处理腔室，...

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Bibliographische Detailangaben
1. Verfasser:	SHIM WOO-PIL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention relates to a substrate processing chamber, and more particularly, to a substrate processing chamber in which various processing processes are performed on a substrate, in which contamination on the inner side of the chamber is minimized and maintenance is simple. 本发明涉及一种基板处理腔室，更详细来说涉及一种在对基板执行各种处理工艺的腔室中将腔室内侧的污染最小化，进而使维修简单的基板处理腔室。