Layered module and gas-assisted binding equipment comprising same

The embodiment of the invention provides a layering module capable of stripping a film from a wafer more effectively and gas-assisted binding equipment comprising the layering module. The layering die for peeling off a film attached to a wafer in a gas-assisted bonding apparatus according to the pre...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PARK SUOL, KIM SOON-HYUN, YOO YOUNG-SUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!