Layered module and gas-assisted binding equipment comprising same

The embodiment of the invention provides a layering module capable of stripping a film from a wafer more effectively and gas-assisted binding equipment comprising the layering module. The layering die for peeling off a film attached to a wafer in a gas-assisted bonding apparatus according to the present invention comprises: an adhesive tape supply part for supplying an adhesive tape for peeling off the film; the film stripping device is used for stripping the film from the wafer by using the adhesive tape; and an adhesive tape recovery unit that recovers the adhesive tape group to which the film is attached. The film peeling apparatus includes: a chuck on which the wafer on which the film is attached is placed and which is configured so as to be capable of moving in a horizontal direction; a peeling roller configured so that an adhesive tape for peeling the film from the wafer comes into contact with the film, and configured so as to be capable of rotating at a speed corresponding to the moving speed of the c