MULTILAYER ELECTRONIC COMPONENT

The invention provides a multi-layer electronic component which comprises a main body, a first electrode and a second electrode, comprising a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface opposite to each other in a third direction; a first external electrode including a first connection portion disposed on the third surface and a first tape portion extending from the first connection portion to a portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface and a second tape portion extending from the second connection portion to a portion of the first surface; an insulating layer disposed on the second surface and extending to the first connection portion and the second connection portion; a first plating layer provided on the first