Power module and bonding wire material determination method thereof

The invention provides a power module and a bonding wire material determination method. The packaging structure of the power module is provided with an IGBT chip and an upper copper layer, the IGBT chip is connected with the upper copper layer through K bonding wires, m bonding wires are made of a first material, the other K-m bonding wires are made of a second material, and the mechanical strength of the first material is larger than that of the second material; m is the number of the bonding wires meeting the first condition; the K bonding wires are made of a second material in simulation; the first condition is that the maximum plastic strain value of the bonding wire measurement position within the preset operation time is greater than or equal to a preset strain value; or m is a preset value, and m is the number of the bonding wires meeting the second condition; the second condition is that the maximum plastic strain values of the bonding wire measurement positions in the preset operation time are the fi