Method for predicting reliability life of welding spot of electronic equipment under thermal-mechanical coupling effect

The invention belongs to the technical field of reliability testing of electronic equipment, particularly relates to a method for predicting the reliability life of a welding spot of electronic equipment under a thermal-mechanical coupling effect, and overcomes the defects of a classical reliability analysis method based on a numerical research method of multi-stress coupling analysis. By means of numerical simulation calculation, reliability analysis of the welding spots in chip packaging of the electronic equipment can be achieved more economically, rapidly and effectively. The welding spot service life analysis under the thermal-mechanical coupling effect of the welding spot of the chip packaging assembly of the electronic equipment is carried out in a mode of fusing theoretical calculation and numerical simulation, the welding spot service life in chip packaging of the electronic equipment can be more economically, rapidly and effectively determined, and technical support can be provided for engineering a