Semiconductor device

A semiconductor device includes a semiconductor element, a conductive member, and a connecting member. The semiconductor element has a back surface on which a first electrode is formed, and a main surface on which a second electrode and a third electrode are formed. The back surface and the main surface are separated from each other in the z direction. And on-off control is carried out between the first electrode and the second electrode according to a driving signal input to the third electrode. The conductive member has a first joining surface and a second joining surface facing the same direction as the back surface. The first bonding surface is bonded to the third electrode. The second bonding surface is disposed so as to be bonded to the connection member and so as not to overlap the semiconductor element when viewed in the z-direction. 一种半导体装置，具有：半导体元件、导通部件以及连接部件。所述半导体元件具有形成有第一电极的背面、以及形成有第二电极和第三电极的主面。所述背面和所述主面在z方向上相互分离。根据输入到所述第三电极的驱动信号，对所述第一电极和所述第二电极之间进行导通截止控制。所述导通部件具有分别朝向与所述背面相同的方向的第一接合面以及第二接合面。所述第一接合面