SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Disclosed is a method for processing a substrate on which a plurality of reference marks and patterns are formed. The method comprises the following steps: process preparation operation; a position information acquisition operation that acquires information on an actual position of the pattern; and a process performing operation of supplying a processing liquid to the substrate and heating the substrate by irradiating a laser beam to the pattern on the substrate to which the processing liquid is applied, the position information acquisition operation comprises the steps of acquiring information about actual positions of at least three reference marks in the plurality of reference marks, and acquiring information about the actual position of the pattern through the information about the actual positions of the reference marks. 公开了一种用于处理基板的方法，在所述基板上形成有多个参考标记和图案。所述方法包括：工艺准备操作；位置信息获取操作，其获取关于所述图案的实际位置的信息；以及工艺执行操作，其将处理液体供应到所述基板，并通过将激光照射到被施加有所述处理液体的所述基板上的所述图案来加热所述基板，所述位置信息获取操作包括获取关于所述多个参考标记中的至少三个参考标记的实际位置的信息，并通过所述参考