Substrate processing apparatus

A substrate processing apparatus is disclosed. The substrate processing apparatus includes: a housing having a processing space in which a substrate is processed; a support unit that supports the substrate in the processing space; the spraying plate is provided with a through hole, and the processing gas flows to the processing space through the through hole; a plasma source that excites plasma by exciting the processing gas supplied to the processing space; and a density adjusting member that adjusts the density of the plasma generated in the processing space by changing the dielectric constant of the dielectric, and is located on the shower plate. 公开了一种基板处理装置。该基板处理装置包括：壳体，其具有处理空间，基板在处理空间中被处理；支撑单元，其支撑处理空间中的基板；喷淋板，其具有通孔，加工气体通过该通孔流向处理空间；等离子体源，其通过激发供应至处理空间的加工气体来激发等离子体；以及密度调整构件，其通过改变电介质介电常数来调整在处理空间中生成的等离子体的密度，并且密度调整构件位于喷淋板上。