APPARATUS FOR PROCESSING SUBSTRATE

An exemplary embodiment of the present invention provides an apparatus for processing a substrate. The apparatus for processing a substrate includes a process chamber having a processing space therein, a support unit for supporting the substrate in the processing space, a gas supply unit for supplying a processing gas to the processing space, and a microwave application unit for applying microwaves to the processing gas to generate plasma; wherein the microwave application unit may include: a first power source for applying a first microwave; a support plate having a groove formed on an upper surface thereof and combined with the process chamber above the support unit to define a processing space; a first transmission plate inserted into the groove to radiate a first microwave to the processing space; and a first waveguide disposed to overlap an upper portion of the first transmission plate and coupled to the first power source, in which a plurality of grooves may be disposed, and the plurality of grooves may