MULTILAYER ELECTRONIC COMPONENT

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other in a first direction, with the dielectric layer interposed between the plurality of intern...

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Bibliographische Detailangaben
Hauptverfasser: KIM HONG-SUK, BEAK JEONG-MI, XU MINSHAN, YANG CHAN-HO, KIM JONG-MIN, KIM MIN-JUN, KIM DA-EUN, CHO SUNG-HYUN, PARK HYE-MIN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other in a first direction, with the dielectric layer interposed between the plurality of internal electrodes; a thermoelectric element provided inside the main body; and an external electrode disposed outside the main body. 本公开提供一种多层电子组件。所述多层电子组件包括:主体,包括在第一方向上彼此堆叠的介电层和多个内电极,并且所述介电层介于所述多个内电极之间;热电元件,设置在所述主体内部;以及外电极,设置在所述主体外部。