MULTILAYER ELECTRONIC COMPONENT
The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other in a first direction, with the dielectric layer interposed between the plurality of intern...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes stacked on each other in a first direction, with the dielectric layer interposed between the plurality of internal electrodes; a thermoelectric element provided inside the main body; and an external electrode disposed outside the main body.
本公开提供一种多层电子组件。所述多层电子组件包括:主体,包括在第一方向上彼此堆叠的介电层和多个内电极,并且所述介电层介于所述多个内电极之间;热电元件,设置在所述主体内部;以及外电极,设置在所述主体外部。 |
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