Compensation method for overlay deviation

An overlay deviation compensation method comprises the steps that a to-be-compensated wafer is provided, the to-be-compensated wafer comprises a central area and an edge area, the central area is provided with a plurality of first measuring points, and the edge area is provided with a plurality of s...

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Bibliographische Detailangaben
Hauptverfasser:	BAI SONG, ZHANG GAOYING, QIU YUNHANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An overlay deviation compensation method comprises the steps that a to-be-compensated wafer is provided, the to-be-compensated wafer comprises a central area and an edge area, the central area is provided with a plurality of first measuring points, and the edge area is provided with a plurality of second measuring points; obtaining a first to-be-compensated deviation of the first measurement point, and obtaining a second to-be-compensated deviation of the second measurement point; performing first compensation processing on the first measurement point by adopting a first global compensation model to obtain first compensated information; performing second compensation processing on the second measurement point by adopting a second global compensation model to obtain second compensated information; and performing third compensation processing on the first residual deviation of each first measurement point and the second residual deviation of each second measurement point by adopting a local compensation model t