Full-inorganic packaging production and preparation equipment and method for deep ultraviolet chip

The invention discloses full-inorganic packaging production and preparation equipment and method for a deep ultraviolet chip in the technical field of deep ultraviolet light emitting diode packaging, and the equipment comprises a bottom plate, and a first belt conveying assembly, a second belt conveying assembly, a packaging housing assembly, a packaging pedestal assembly and a mounting assembly which are disposed on the bottom plate. The first belt conveying assembly and the second belt conveying assembly are used for conveying the packaging shell assembly and the packaging base assembly correspondingly. The mounting assembly is used for automatically mounting the packaging shell assembly on the packaging base so as to realize automatic inorganic packaging of the deep ultraviolet chip; according to the invention, automatic inorganic packaging of the deep ultraviolet chip can be realized, and the deep ultraviolet chip after inorganic packaging can be more beautiful. 本发明公开了深紫外发光二极管封装技术领域的一种深紫外芯片的全无机封装生产制备设备及方法