Chip cutting-up method, device and equipment and computer readable storage medium

The invention is suitable for the technical field of chip manufacturing, and provides a chip cutting-up method, device and equipment and a computer storage medium, the chip cutting-up device comprises a first mounting base, a cutting knife, a detection mechanism and a control module, and the cutting knife is arranged on the first mounting base; the detection mechanism is used for detecting contact information of the scratching knife and the surface of the wafer; and the control module is used for receiving the contact information detected by the detection mechanism, determining the position information of the contact point of the cutter and the surface of the wafer according to the contact information, and controlling the cutter to cut the wafer through the position information and the cutter depth compensation acquired by the control module. According to the embodiment of the invention, the cutting depths of all wafers by the cutting knife can be the same, so that the yield of splinters is improved. 本申请适用于芯片