Electroplated copper wire with high wear resistance and processing technology thereof

The invention relates to the technical field of copper wires, and provides a high-wear-resistance electro-coppering lead and a processing technology thereof, the technical key points are that the anti-oxidation corrosion electro-coppering lead for a semiconductor comprises a conductive lead and a plating layer, the conductive lead comprises a copper lead product manufactured by the following mass percent: 2-3% of Sn, 0.1-0.25% of P, 0.05-0.1% of Zn, and the balance of Cu; the plating layer is pure gold; the oxidation-corrosion-resistant electroplated copper lead for the semiconductor has high electrical conductivity and thermal conductivity, meanwhile has good strength and hardness, and further has the advantages of being resistant to heat and abrasion and high in deformation prevention capacity; the tensile strength reaches 490 MPa, the impact displacement reaches 4.6 mm, the ductility reaches 29%, the bending resistance reaches 22 KN, the hardness reaches 83 HRB, and the comprehensive performance is excelle