Cooling module and electronic device

The invention provides a cooling module capable of ensuring cooling capability and reducing cost, and an electronic device provided with the cooling module. The cooling module is provided with: a fan having a fan housing in which an air suction port and an air discharge port are formed; a heat sink disposed facing an exhaust port of the fan; a heat pipe connected to the surface of the heat sink; and a plate-type vapor chamber in which the heat pipe is connected to a first surface of the vapor chamber in a state of straddling one edge portion of the vapor chamber, and a second surface of the one edge portion is connected to a surface of the heat sink so as to be parallel to the heat pipe, such that the one edge portion is sandwiched between the heat pipe and the heat sink. 本发明提供一种能够确保冷却能力并降低成本的冷却模块及具备冷却模块的电子设备。冷却模块具备：风扇，具有形成有吸气口及排气口的风扇壳体；散热片，面向上述风扇的排气口配置；热管，与上述散热片的表面连接；以及板型的均热板，上述热管以跨越上述均热板的一缘部的状态与上述均热板的第一表面连接，上述一缘部的第二表面与上述热管并排地连接于上述散热片的表面，从而上述一缘部夹在上述热管与上述散热片之间。