CMP alarm method

The invention discloses a CMP alarm method, and belongs to the field of semiconductor devices and manufacturing. The CMP alarm method is provided for solving the problem of stress damage caused by an emergency stop mode adopted in the related technology when an alarm is given in the wafer grinding process, the grinding fluid grinding procedure can be stopped when the alarm occurs, the water grinding procedure is carried out in a leapfrogging mode, grinding fluid on the surface of the wafer can be removed in the water grinding procedure, and film corrosion is prevented; and the stability of the CMP process is improved. 本申请公开了一种CMP警报方法，属于半导体器件及制造领域。本方法，针对晶圆在研磨过程中遇到警报时相关技术中采用急停方式带来的应力损伤问题，提供了一种CMP警报方法，能够在警报发生时终止研磨液研磨工序跳步进入水磨工序，水磨工序可以去除晶圆表面的研磨液，防止薄膜腐蚀，提高了CMP过程的稳定性。