Semiconductor package, semiconductor device, and power conversion device

A semiconductor package (100) is provided with a semiconductor element (1), a first insulating layer (5), a first wiring layer (6), a second insulating layer (7), and a second wiring layer (8). The first insulating layer (5) covers the semiconductor element (1). The first wiring layer (6) includes a first layer portion (61). The first layer section (61) covers the first insulating layer (5). The second insulating layer (7) covers the first insulating layer (5) and the first wiring layer (6). The second wiring layer (8) is electrically connected to the semiconductor element (1) through the second through-hole (TH2) and the third through-hole (TH3). The second wiring layer (8) includes a second layer portion (81). The second layer section (81) covers the second insulating layer (7). A second layer section (81) of the second wiring layer (8) has a portion superimposed on the first layer section (61) of the first wiring layer (6) with the second insulating layer (7) interposed therebetween. 半导体封装(100)具备半导体元件(1)、第