Polishing liquid composition for silicon oxide film

In one embodiment, the present invention provides a polishing liquid composition for a silicon oxide film, which can both improve the polishing speed of the silicon oxide film and reduce the line width dependence of the polishing speed in a concave-convex pattern. One embodiment of the present inven...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YAMAGUCHI TETSUFUMI, INOUE MASAKI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:In one embodiment, the present invention provides a polishing liquid composition for a silicon oxide film, which can both improve the polishing speed of the silicon oxide film and reduce the line width dependence of the polishing speed in a concave-convex pattern. One embodiment of the present invention relates to a polishing liquid composition for a silicon oxide film, which contains cerium oxide particles (component A), a compound (component B) represented by formula (I) or formula (II), a nitrogen-containing heteroaromatic compound (component C) in which at least one hydrogen atom is substituted with a hydroxyl group, and an aqueous medium. 本发明在一个方式中,提供一种氧化硅膜用研磨液组合物,其可以兼顾氧化硅膜的研磨速度的提高和凹凸图案处的研磨速度的线宽依赖性的降低。本发明在一个方式中涉及一种氧化硅膜用研磨液组合物,其含有氧化铈粒子(成分A)、下述式(I)或式(II)所表示的化合物(成分B)、至少1个氢原子被羟基取代的含氮杂芳香族化合物(成分C)、及水系介质。