Improved structure for transition between transmission line conductor and solder ball

Improved structures for transitions between transmission line conductors and solder balls are disclosed. An apparatus is described. The apparatus includes a semiconductor chip package substrate having a transmission line. The transmission line has a conductor for conducting a current of a signal propagating along the transmission line. The conductor has a width that increases as the conductor approaches the vertical transition region. The vertical transition region is located between the conductor and the solder ball. The transition region has a plurality of conductive vias at the same layer of the substrate. The plurality of conductive vias are electrically connected to the conductor. The plurality of conductive vias are disposed radially about a central axis of the solder ball. 公开了用于传输线导体与焊料球之间的过渡的改进结构。描述了一种设备。该设备包括具有传输线的半导体芯片封装衬底。该传输线具有用于传导沿该传输线传播的信号的电流的导体。该导体具有随着该导体接近垂直过渡区域而扩大的宽度。该垂直过渡区域位于该导体与焊料球之间。该过渡区域具有位于该衬底的同一层处的多个导电过孔。所述多个导电过孔电连接至该导体。所述多个导电过孔围绕该焊料球的中心轴径向布置。