Pixel array packaging structure

A pixel array packaging structure comprises a substrate, a pixel array, a reflecting layer, a light absorbing layer and a light transmitting layer. The pixel array is arranged on the substrate. The pixel array comprises a plurality of light emitting diode chips. The light emitting diode chips comprise at least one red light diode chip, at least one green light diode chip, at least one blue light diode chip and a combination thereof. The reflecting layer is arranged on the substrate and located between any two adjacent light emitting diode chips. The light absorbing layer is located above the reflecting layer and surrounds the pixel array. The light transmitting layer is arranged on the pixel array, the reflecting layer and the light absorbing layer. The light-transmitting layer is provided with an upper surface and a lower surface opposite to the upper surface. The lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 to 0.1 mm. According to the embodiments provided