Sensor
The invention relates to a sensor and a time-of-flight system. Wherein the sensor may include: a first substrate including: a first semiconductor layer, the first semiconductor layer including: a first avalanche photodiode including a first cathode region and a first anode region; and a first isolat...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a sensor and a time-of-flight system. Wherein the sensor may include: a first substrate including: a first semiconductor layer, the first semiconductor layer including: a first avalanche photodiode including a first cathode region and a first anode region; and a first isolation region, a first wiring layer, the first wiring layer including: a first wiring; a first via through which the first cathode region is electrically connected to the first wiring; a second wiring; and a second via through which the first anode region is electrically connected to the second wiring; and a second substrate laminated on the first substrate, the second substrate including: a second wiring layer, the second wiring layer including: a third wiring directly bonded to the first wiring; a fourth wiring directly bonded to the second wiring; and a second semiconductor layer, the first anode region being located between the first cathode region and the first isolation region.
本发明涉及传感器和飞行时间系统。其中,所述传感器可包括:第一基板,包 |
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