Semiconductor packaging structure
The embodiment of the invention discloses a semiconductor packaging structure. The semiconductor packaging structure comprises a substrate; the chip is attached to the top surface of the substrate; the reinforcing structure surrounds the chip and is attached to the top surface of the substrate; the...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiment of the invention discloses a semiconductor packaging structure. The semiconductor packaging structure comprises a substrate; the chip is attached to the top surface of the substrate; the reinforcing structure surrounds the chip and is attached to the top surface of the substrate; the reinforcing structure comprises a reinforcing ring and at least one reinforcing rib which is symmetrically arranged on the inner side of the reinforcing ring and forms a closed pattern with the reinforcing ring; the reinforcing ribs and the reinforcing ring are located in the same plane.
本申请实施例公开了一种半导体封装结构,包括:基板;芯片,贴附于所述基板的顶表面上;加强结构,环绕所述芯片贴附于所述基板的顶表面上;所述加强结构包括加强环、对称设置在所述加强环内侧、且与所述加强环构成封闭图形的至少一个加强筋;其中,所述加强筋与所述加强环位于同一平面内。 |
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