Packaging structure and method of high-power device

The invention provides a packaging structure and method of a high-power device, and relates to the technical field of chip packaging, the packaging structure comprises a base island, chips, a plastic package body and pins, the plurality of chips are bonded on the base island, the plurality of chips are connected through first metal wires, an elastic material layer is arranged on the base island, the elastic material layer wraps the peripheries of the chips and the first metal wires, and the pins are arranged on the plastic package body. The periphery of the elastic material layer and the base island is coated with a plastic package body, the plastic package body is provided with a through hole, one end of the through hole is communicated with the outside of the plastic package body, the other end of the through hole extends to the outside of the elastic material layer, one end of the pin is embedded in the plastic package body and is connected with the chip through a second metal wire, and the other end of th