High-reliability system-in-package structure and packaging method thereof

The invention provides a high-reliability system-in-package structure and a packaging method thereof, and belongs to the technical field of system-in-package. The structure comprises an upper-layer ceramic substrate, a lower-layer ceramic substrate, a closed enclosure frame, a cover plate and a switching PCB (Printed Circuit Board), a microcavity for bonding a chip is arranged on the substrate, the closed enclosure frame is welded on the lower-layer ceramic substrate, the cover plate is welded on the closed enclosure frame, the upper-layer ceramic substrate and the lower-layer ceramic substrate are interconnected and welded through BGA (Ball Grid Array) balls, and the switching PCB is welded on the lower surface of the lower-layer ceramic substrate. According to the invention, the advantages of high density and high performance packaging integration of the ceramic substrate and the advantages of high reliability of the switching PCB are organically combined, and the method is suitable for engineering applicat