Semiconductor chip packaging device

The invention relates to a semiconductor chip packaging device, and aims to solve the technical problem that the production cost of a chip and a chip socket is relatively high since a current chip main body and an adaptive chip socket are mostly processed and packaged through two machine devices. Co...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YANG CHAO, DING HAOCHEN, WANG FAJIAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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