Semiconductor chip packaging device

The invention relates to a semiconductor chip packaging device, and aims to solve the technical problem that the production cost of a chip and a chip socket is relatively high since a current chip main body and an adaptive chip socket are mostly processed and packaged through two machine devices. Comprising an operation machine table, a sliding rail, a workpiece clamping arm, a pump supply machine, a secondary driving mechanism, an upper die mechanism, a driving block, a lower die mechanism, a turnover mechanism, a dislocation mechanism, an auxiliary driving machine and a feeding mechanism. Operating the machine table; wherein an adjusting groove is formed in the table top of the operating machine table, the sliding rails are arranged on the two sides of the adjusting groove, and the workpiece clamping arms are transversely arranged above the input ends of the sliding rails and connected with the operating machine table. According to the semiconductor chip packaging device, the lower mold mechanism is arrange