Method for detecting and positioning circle center of wafer based on machine vision
The invention relates to the technical field of image processing, in particular to a wafer circle center detecting and positioning method based on machine vision, which comprises the following steps: acquiring a wafer image, and carrying out graying processing on the image; finding a connected regio...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of image processing, in particular to a wafer circle center detecting and positioning method based on machine vision, which comprises the following steps: acquiring a wafer image, and carrying out graying processing on the image; finding a connected region of the wafer image, and removing a noise region in the connected region through a threshold value to obtain a noise-removed image; processing the de-noised image by using an improved channel attention mechanism and space attention mechanism module; processing the output image under the attention mechanism by adopting a Sobel operator and Canny operator combined edge detection method; edge points are calculated from the output after edge detection through Hough straight line detection; and fitting the edge points by adopting a least square method to obtain the circle center position of the wafer. The problem that the wafer center positioning precision is affected by low wafer image quality is solved.
本发明涉及图像处理技术领域 |
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