Method, device, equipment and medium for determining concentration of additive in acidic copper plating solution based on ultramicroelectrode

The invention relates to the technical field of electrochemical analysis, in particular to a method, a device, equipment and a medium for determining the concentration of an additive in an acidic copper plating solution based on an ultramicro electrode. According to the determination method provided by the invention, cyclic voltammetry scanning is carried out by adopting a three-electrode system taking an ultramicro electrode as a working electrode, and accurate determination of the concentrations of the accelerator, the leveling agent and the inhibitor in the plating solution sample to be determined is realized according to the corresponding relation between the dissolved-out electric quantity of a deposited copper anode and the concentration of the additive and accurate regulation and control of influence factors. By using the method disclosed by the invention, the concentrations of the three additives including the accelerator, the leveling agent and the inhibitor in the acidic copper plating solution can