Metallized film, preparation method and application

The invention relates to the technical field of metallized films, in particular to a metallized film, a preparation method and application, and the metallized film comprises a substrate layer, a transition layer and a copper-clad layer; the transition layer is located between the substrate layer and the copper-clad layer, and the copper-clad layer is obtained by processing on the transition layer through a laser scanning method. The transition layer is an aluminum oxide layer, and the step of forming the transition layer on the surface of the pretreated substrate layer in a vacuum evaporation mode comprises the following steps: carrying out aluminum plating treatment on the surface of the substrate layer, and then continuously introducing oxidizing gas into the surface of the aluminum plating layer so as to form the aluminum oxide layer on the surface of the substrate layer. According to the technical scheme, the transition layer is formed on the substrate layer, the copper-clad layer is formed on the transit