Palladium-free activating solution for chemical copper plating and preparation method of palladium-free activating solution

The invention provides a palladium-free activating solution for chemical copper plating, which comprises the following components: 1-4mL/L of ethidene diamine; 1.8 to 2.0 g/L of silver nitrate; 0.01 to 0.05 g/L of sodium tetradecyl sulfate; and the balance of deionized water. The preparation method...

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Hauptverfasser: LI LIQING, YU RONGXIANG, ZHANG BENHAN, XU YONGZHANG, ZHENG MINGHAO, YANG LIN, ZOU LAIXI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention provides a palladium-free activating solution for chemical copper plating, which comprises the following components: 1-4mL/L of ethidene diamine; 1.8 to 2.0 g/L of silver nitrate; 0.01 to 0.05 g/L of sodium tetradecyl sulfate; and the balance of deionized water. The preparation method of the palladium-free activating solution for chemical copper plating comprises the following steps: dissolving silver nitrate in deionized water, and then adding ammonia water to form a basic activating solution; ethylenediamine and sodium tetradecyl sulfate are added into the basic activating solution to be uniformly mixed to form the palladium-free activating solution. The obtained palladium-free activating solution is easy to prepare and good in stability. 本发明提供化学镀铜用无钯活化液,包括以下成分:乙二胺,1-4mL/L;硝酸银,1.8-2.0g/L;十四烷基硫酸钠,0.01-0.05g/L;余量为去离子水。化学镀铜用无钯活化液的制备方法,包括以下步骤:将硝酸银溶于去离子水中,再加入氨水形成基础活化液;将乙二胺和十四烷基硫酸钠加入到基础活化液中混合均匀形成该无钯活化液。本发明获得的无钯活化液易于制备,稳定性好。