Electronic-grade copper-clad plate resin and preparation method thereof

The invention relates to the technical field of resin preparation, in particular to electronic-grade copper-clad plate resin and a preparation method thereof. The preparation method of the electronic-grade copper-clad plate resin comprises the following steps: respectively dissolving bisphenol A epoxy resin, a polyethersulfone resin mixture, polyphenyl ether, toughened resin, heat-resistant resin and polyhedral oligomeric silsesquioxane in a solvent, mixing the obtained solutions, adding inorganic nanoparticles, a dispersing agent and a coupling agent, uniformly stirring, and carrying out vacuum drying to obtain the electronic-grade copper-clad plate resin. And performing rotary evaporation to remove the solvent to obtain the electronic-grade copper-clad plate resin. The cured product of the electronic-grade copper-clad plate resin provided by the invention has the advantages of good toughness, high Tg, high flame retardance, high toughness, high dimensional stability and low dielectric loss, and the inventio