Power semiconductor device
The invention provides a power semiconductor device. The power semiconductor device comprises a terminal seat. The terminal seat is provided with a first end and a second end which are opposite to each other, the first end is provided with a first flange expanding outwards, the first flange is welde...
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creator | WU SHENGCAI GAO GUOSHU YU TAIJUN WU HANLIN LI TAIGUANG ZHANG JINGYAO |
description | The invention provides a power semiconductor device. The power semiconductor device comprises a terminal seat. The terminal seat is provided with a first end and a second end which are opposite to each other, the first end is provided with a first flange expanding outwards, the first flange is welded on a connecting pad of a substrate through welding flux, and an included angle between an extending direction of the first flange and a length direction of the terminal seat is larger than 90 degrees.
本发明提供一种功率半导体装置,包括一端子座。端子座具有相对的一第一端与一第二端,其中第一端具有向外扩展的一第一凸缘,第一凸缘通过焊料焊接于一基板的一接垫,第一凸缘的一延伸方向与端子座的一长度方向的夹角大于90度。 |
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本发明提供一种功率半导体装置,包括一端子座。端子座具有相对的一第一端与一第二端,其中第一端具有向外扩展的一第一凸缘,第一凸缘通过焊料焊接于一基板的一接垫,第一凸缘的一延伸方向与端子座的一长度方向的夹角大于90度。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230620&DB=EPODOC&CC=CN&NR=116266566A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230620&DB=EPODOC&CC=CN&NR=116266566A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WU SHENGCAI</creatorcontrib><creatorcontrib>GAO GUOSHU</creatorcontrib><creatorcontrib>YU TAIJUN</creatorcontrib><creatorcontrib>WU HANLIN</creatorcontrib><creatorcontrib>LI TAIGUANG</creatorcontrib><creatorcontrib>ZHANG JINGYAO</creatorcontrib><title>Power semiconductor device</title><description>The invention provides a power semiconductor device. The power semiconductor device comprises a terminal seat. The terminal seat is provided with a first end and a second end which are opposite to each other, the first end is provided with a first flange expanding outwards, the first flange is welded on a connecting pad of a substrate through welding flux, and an included angle between an extending direction of the first flange and a length direction of the terminal seat is larger than 90 degrees.
本发明提供一种功率半导体装置,包括一端子座。端子座具有相对的一第一端与一第二端,其中第一端具有向外扩展的一第一凸缘,第一凸缘通过焊料焊接于一基板的一接垫,第一凸缘的一延伸方向与端子座的一长度方向的夹角大于90度。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAKyC9PLVIoTs3NTM7PSylNLskvUkhJLctMTuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaGZkZmZqZmZo7GxKgBAGMSI0s</recordid><startdate>20230620</startdate><enddate>20230620</enddate><creator>WU SHENGCAI</creator><creator>GAO GUOSHU</creator><creator>YU TAIJUN</creator><creator>WU HANLIN</creator><creator>LI TAIGUANG</creator><creator>ZHANG JINGYAO</creator><scope>EVB</scope></search><sort><creationdate>20230620</creationdate><title>Power semiconductor device</title><author>WU SHENGCAI ; GAO GUOSHU ; YU TAIJUN ; WU HANLIN ; LI TAIGUANG ; ZHANG JINGYAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116266566A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>WU SHENGCAI</creatorcontrib><creatorcontrib>GAO GUOSHU</creatorcontrib><creatorcontrib>YU TAIJUN</creatorcontrib><creatorcontrib>WU HANLIN</creatorcontrib><creatorcontrib>LI TAIGUANG</creatorcontrib><creatorcontrib>ZHANG JINGYAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WU SHENGCAI</au><au>GAO GUOSHU</au><au>YU TAIJUN</au><au>WU HANLIN</au><au>LI TAIGUANG</au><au>ZHANG JINGYAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Power semiconductor device</title><date>2023-06-20</date><risdate>2023</risdate><abstract>The invention provides a power semiconductor device. The power semiconductor device comprises a terminal seat. The terminal seat is provided with a first end and a second end which are opposite to each other, the first end is provided with a first flange expanding outwards, the first flange is welded on a connecting pad of a substrate through welding flux, and an included angle between an extending direction of the first flange and a length direction of the terminal seat is larger than 90 degrees.
本发明提供一种功率半导体装置,包括一端子座。端子座具有相对的一第一端与一第二端,其中第一端具有向外扩展的一第一凸缘,第一凸缘通过焊料焊接于一基板的一接垫,第一凸缘的一延伸方向与端子座的一长度方向的夹角大于90度。</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Power semiconductor device |
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