Electronic device with conductive through hole array substrate

The invention discloses an electronic device with a conductive through hole array substrate. The electronic device comprises a substrate, an outer layer plate, a conductive circuit layer and a switchable circuit chip, the substrate is provided with a plurality of first conductive through holes. The outer layer plate is arranged on one side of the substrate and is provided with a plurality of second conductive through holes. The distribution density or number of the first conductive through holes is greater than the distribution density or number of the second conductive through holes, so that a part of the first conductive through holes are electrically connected to the second conductive through holes, and a part of the first conductive through holes are electrically floating. The conductive circuit layer is arranged on the outer layer plate and is provided with a plurality of conductive wires. The conductive wire is electrically connected to the second conductive via. The switchable circuit chip is electrica