Electronic device with alignment mark

The invention discloses an electronic device with alignment marks. The electronic device comprises a conductive through hole array substrate, an outer layer plate and an alignment substrate. The conductive through hole array substrate is provided with a plurality of first conductive through holes. The outer layer plate is provided with a plurality of second conductive through holes and is arranged on one side of the conductive through hole array substrate. The distribution density or number of the first conductive through holes is greater than that of the second conductive through holes. A portion of the first conductive vias is electrically connected to the second conductive vias, and the other portion is electrically floating. The alignment substrate comprises a core layer arranged on the outer layer plate, a plurality of conductive traces arranged in the core layer, a plurality of inner connecting pads and a plurality of alignment mark pads. The inner connecting pad and the alignment mark pad are arranged