Chip packaging structure and manufacturing method thereof

The invention provides a chip packaging structure and a manufacturing method thereof. The chip packaging structure comprises a rewiring structure, a chip, a first packaging colloid, a plurality of conductive terminals and a second packaging colloid. The redistribution structure has a first surface, a second surface opposite to the first surface, and a peripheral surface connecting the first surface and the second surface. The chip is disposed on the first surface of the redistribution structure and electrically connected to the redistribution structure. The first encapsulant encapsulates the redistribution structure and the chip, wherein the first encapsulant covers the peripheral surface of the redistribution structure. The plurality of conductive terminals are disposed on the second surface of the redistribution structure and electrically connected to the redistribution structure. The second packaging colloid is arranged on the redistribution structure and covers the second surface of the redistribution str