Reprocessable zero force insert electro-optic package socket and method

An electronic device includes: an electro-optical circuit package including at least one photonic integrated circuit (PIC) having at least one light source and a package substrate; a printed circuit board (PCB) including at least one optical connector for receiving light from the at least one light source; and a plurality of liquid metal electrical contacts disposed between the package substrate and the PCB. 一种电子设备，包括：电光电路封装，电光电路封装包括具有至少一个光源的至少一个光子集成电路(PIC)以及封装衬底；印刷电路板(PCB)，包括用于从至少一个光源接收光的至少一个光连接器；以及多个液态金属电触点，设置在封装衬底与PCB之间。