Compositions for depositing palladium coatings on substrates

The present invention relates to a composition for depositing a palladium coating on a substrate, in particular on a nickel-coated substrate, said composition comprising: (i) palladium ions, (ii) chloride ions, (iii) ethylenediamine (EDA), (iv) ethylenediamine disuccinate (EDDS), and (v) at least on...

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Bibliographische Detailangaben
Hauptverfasser:	D. VOLOSHAIN, SPREEMANN RUEDIGER, LAUDAN DAVID, TEWS DIRK, HIRSEKORN IDA-ROSE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention relates to a composition for depositing a palladium coating on a substrate, in particular on a nickel-coated substrate, said composition comprising: (i) palladium ions, (ii) chloride ions, (iii) ethylenediamine (EDA), (iv) ethylenediamine disuccinate (EDDS), and (v) at least one reducing agent. 本发明涉及用于在衬底上，特别是在经镍涂覆的衬底上沉积钯涂层的组合物，所述组合物包含：(i)钯离子，(ii)氯离子，(iii)乙二胺(EDA)，(iv)乙二胺二琥珀酸盐(EDDS)，和(v)至少一种还原剂。