SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

A semiconductor device and a manufacturing method thereof. A packaged electronic device includes a molded substrate including a conductive structure having edge leads and inner leads, the edge leads having opposing outward and inward facing sides, and the inner leads having opposing outward and inward facing sides. The molded substrate includes a substrate encapsulant covering inboard lower portions of the edge leads and inboard and outboard lower portions of the inner leads. An outboard upper portion of the edge lead and an outboard upper portion of the inner lead are exposed from the substrate encapsulant. The electronic component is connected to the edge lead and the inner lead. The body encapsulant covers portions of the electronic component and the conductive structure and has a top side and a plurality of side surfaces, an outboard upper portion of the edge lead is exposed from one of the side surfaces of the body encapsulant, and the body encapsulant covers an outboard upper portion of the inner lead a