Photoetching machine and preparation method of circuit substrate

The embodiment of the invention discloses a photoetching machine which is characterized in that a projection lens group is arranged on the light emitting side of a mask plate setting position (a second setting position), and the projection lens group comprises a first lens unit and a second lens unit; the convergence angle of the first lens unit to the incident light is larger than the convergence angle of the second lens unit to the incident light. The projection lens group is adopted to carry out light convergence on the pattern on the mask plate, so that a pattern smaller than the pattern on the mask plate is formed on the substrate, and the effect of realizing a precise process by adopting a conventional mask plate is further achieved. In addition, the first lens unit is used for forming an integrated circuit, and the second lens unit is used for forming a non-integrated circuit, so that the working efficiency and the adaptability of the manufacturing process are improved. 本申请实施例公开了一种光刻机，本申请实施例的光刻机采用在掩模板设