Linear cutting efficiency improving device and using method thereof
The workpiece linear cutting efficiency improving device comprises a bottom plate and an index plate, the index plate is connected with the bottom plate, a through hole is formed in the bottom plate, a tool setting groove is formed in the edge of the bottom plate, a main index hole corresponding to...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The workpiece linear cutting efficiency improving device comprises a bottom plate and an index plate, the index plate is connected with the bottom plate, a through hole is formed in the bottom plate, a tool setting groove is formed in the edge of the bottom plate, a main index hole corresponding to the through hole in position is formed in the index plate, and a plurality of auxiliary index holes are formed in the index plate with the main index hole as the reference. The position relation of the main indexing hole and the auxiliary indexing hole corresponds to a plurality of cutting positions of a workpiece; when the main indexing hole coincides with the through hole, a main yielding groove is formed in the position, corresponding to the tool setting groove, of the indexing plate; a plurality of auxiliary receding grooves are further formed in the index plate, each auxiliary receding groove corresponds to one auxiliary index hole, and the included angle between each auxiliary receding groove and the correspo |
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